国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5） C09（5） H01（2）
H05（2）
IPC小类 C08K（5）
IPC C09K005/14（5）
发明人 REN L（2） SUN R（2） XU J（2）
YE Z（2） ZENG X（2） ZHANG C（2）
ZHANG Y（2）
公开年 2021（5）
申请年 2020（5）
专利权人 SHENZHEN INS.（2）

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Preparation of graphite oriented thermal interface material involves mixing raw material components of graphite oriented thermal interface material, orienting, freezing, cutting, performing high temperature curing treatment and cutting.

ZENG X, ZHANG C, YE Z, REN L, ZHANG Y, XU J, SUN R, ZHAGN Y

Modifying graphite powder useful for preparing polyolefin-based graphite orientation-type thermal interface material, comprises e.g. performing plasma etching pretreatment on graphite powder, and subjecting to hydroxylation treatment.

ZENG X, ZHANG C, YE Z, REN L, ZHANG Y, XU J, SUN R

High thermal conductivity reinforced polyphenylene sulfide composite material comprises polyphenylene sulfide substrate, surface carbonization reinforcement and thermally conductive filler.

ZHOU G, YIN H, CHEN Z, HAN Y, SHEN J, DENG H, ZHOU Y

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N