国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5） C09（5）
IPC小类 C08K（5）
IPC C08K003/04（5）
发明人 LI J（5）
公开年 2021（5）
申请年 2019（2）  2020（2） 
专利权人 UNIV BEIJING.（2）

Method for improving heat dissipation of LED, involves respectively utilizing graphene and its derivative graphene oxide as external dopants to increase thermal conductivity of epoxy resin composite material and improves heat dissipation of epoxy resin encapsulated LED.

LI J, YI X, CUI K, DING H, XIE H

Preparing recyclable wear-resistant and high thermal conductivity nylon 66 composite material involves weighing nylon 66 resin, graphene microchips, modified nano-silica, compatibilizer, antioxidant, silane coupling agent, carbon fiber.

XIE F, ZHENG J, LIU M, LI J

High heat-conducting rubber nano-composite material, comprises rubber latex, graphene oxide aqueous dispersion, nano heat-conducting filler, reducing agent, emulsifying agent and vulcanizing agent.

LU Y, LI J, ZHANG C, XIAN Y, LIN Y, ZHAO X, ZHANG L

Preparing heat-conductive filler three-dimensional framework comprises e.g. mixing aqueous graphene oxide dispersion with thermally conductive filler, adding reducing agent and surfactant, stirring, then sealing, drying and heat-treating.

LU Y, LI J, LIN Y, ZHANG C, XIAN Y, ZHAO X, ZHANG L

Graphene reinforced rigid polyvinyl chloride thermally conductive composite material comprises e.g. polyvinyl chloride resin, graphene, graphene surface treatment agent, thermal conductive filler, and sterically hindered filler.

LIU B, ZHANG Z, ZHU Y, LIU T, LI J