国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4） C09（4）
IPC小类 C08K（4）
IPC C09K005/14（4）
发明人 LI M（4）
公开年 2021（4）
申请年 2021（3） 
专利权人

Preparation of heat conducting gasket used for electronic products by mixing phase change material, heat conducting filler, matrix material and crosslinking agent, performing curing crosslinking reaction, and freezing preform.

CHU W, JIANG N, LI M, YU J

Thermally conductive composite filler useful in high thermal conductivity composite material, comprises preset thermally conductive filler having three-dimensional structure, specific thermally conductive filler and polymer adhered to inner surface of preset thermally conductive filler.

WANG H, BAO D, ZHU Y, WANG J, LI M, YUAN R

Preparing composite heat conducting interface material heat conducting silicone grease involves weighing alumina by weight component, aluminum hydroxide, zinc oxide, graphene and solvent, where the solvent is dimethyl silicone oil.

LI M

Aluminum-plastic film additive used for preparing flame-retardant aluminum-plastic film, is prepared by performing chemical grafting modification on alkaline substance and carbon-based nano-filler using silane coupling agent, and coating.

HU Y, LIU T, CHEN D, TU F, JIANG L, ZHANG W, ZHANG Y, YANG D, DANG Z, XIANG J, LI M, CHEN J