国家/地区 中国（5）
IPC部 C（6） H（2）
IPC大类 C09（6）
IPC小类 C09D（6）
IPC C09D179/08（6）
发明人 CAO H（2） LIU G（2） XU Z（2）
ZHANG Q（2） ZHU C（2）
公开年 2023（6）
申请年 2022（5） 
专利权人 ZHEJIANG ZHO.（2）

Graphene water-based wave-absorbing coating structure comprises base layer, where front surface of base layer is provided with first function layer comprising cooling glue heat insulation coating and polyimide coating layer.

DONG H, ZHANG S, LI B

High wear-resistant type polyimide enamel wire coating used in e.g. electronic electric, comprises fluorine-containing polyimide, nano silicon dioxide, polydimethylsiloxane, modified graphene, and nano-calcium carbonate.

YE H, WANG S, ZHANG F, ZHANG B

Polyimide paint useful for high heat-resistant enameled wire for electronic appliances, household appliances and instrument equipment, comprises polyamic acid solution obtained by polycondensation of aromatic dianhydride, aromatic diamine and fluorinated amino graphene.

XU Z, LIU G, ZHU C, CAO H, ZHANG Q

Forming multifunctional surface coating, involves providing substrate; providing barrier coating forming solution, applying barrier coating forming solution to surface of substrate; providing antimicrobial coating forming solution, applying, after predetermined time duration.

MCCONNELL D C, REXWINKLE I, MARTZ T, POTEET S, PIMENTEL K U

High thermal conductivity aluminum-based liquid cooling plate base material used in power battery system, comprises aluminum plate and polyimide layer coated on aluminum plate and polyimide layer comprises polyimide and graphene/cuprous oxide composites uniformly dispersed in polyimide.

XU Z, LIU G, ZHU C, CAO H, ZHANG Q

Polyimide composite material used as core base material in office automation equipment, comprises polyimide acid, heat conducting filler, conductive filler, and auxiliary agent, heat-conducting filler is metal-organic framework material, covalent organic framework, black phosphorus, red phosphorus.

LIU Z, WEI Z