国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4） C25（4） C08（2）
IPC小类 C09D（4）
IPC C25D005/56（4）
发明人 SHAO Z（2） SUN J（2） WU B（2）
ZHENG N（2）
公开年 2023（3）
申请年 2022（3） 
专利权人 TAN KAH KEE .（2） UNIV XIAMEN（2）

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Electroplating plastic surface useful for door guard plate of automobile comprises mixing graphene, silicon dioxide sol, epoxy resin, curing agent and water, removing oil, spraying mixed slurry, carrying out chemical plating and electroplating, washing, and drying.

LI J, SUN L