国家/地区 美国（5）
IPC部 C（5）
IPC大类 C09（5）
IPC小类 C09D（5）
IPC H05K009/00（3） C09D005/00（2） C09D005/32（2）
C09D007/61（2） C09D175/04（2）
发明人
公开年 2021（3） 2022（2）
申请年 2021（5）
专利权人

Electromagnetic wave absorption structure comprises electromagnetic wave composite absorbing layer, where electromagnetic wave composite absorbing layer comprises conductive composite layer and insulating layer, and insulating layer is stacked and overlapped with conductive composite layer.

WU F

Carbogenic nanoparticle-conducting polymer composite ink for thin film coated printed circuit board, dispersed in water, where carbogenic nanoparticle is reduced graphene oxide, and composite ink includes e.g. graphene oxide-polypyrrole composite ink and carbon quantum dots-polyaniline composite ink.

BHATTACHARJEE L, SHARMA A, MANNA U, GOEL A, PAL B, BESSEMER C

Electromagnetic interference shielding material useful for EMI shielding applications on electronic devices and circuit boards, comprises biopolymer or polymer dissolved in organic solvents, and shielding guest materials comprising particles, powders, tubes or rods, flakes, fiber or sheets.

GROTE J G, SALOUR M M, ZANG D Y

Invisible ice-covering-proof compatible material useful as surface material of equipment, comprises insulating and heat insulating layer comprises e.g. polyimide, glass fiber, hollow glass microsphere and/or polyurethane and patterned heating, insulating heat conducting and hydrophobic layer.

MA Z, ZHAN X, WANG Z, ZHAO Z, ZHU Y, CHEN J, LIU X, CHEN H

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K