国家/地区 美国（5） 世界知识产权组织（4） 中国（3） 韩国（3） 欧洲专利局（EPO）（2） 日本（2） 台湾（2）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K005/00（5）
发明人
公开年
申请年
专利权人

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Electroconductive composition used as e.g. coating material for forming antistatic film and base material, comprises cellulose nanofibers, inorganic powder chosen from graphene, graphene oxide and their derivatives and microparticles.

KONAGAYA S, SHIBUYA H, SARUYAMA T

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Composition, useful to manufacture film used in transmissive electrode for organic electronic device, comprises, in solvent preparation, non-tubular graphene material, electrically conductive polymer including polythiophenes, and additive.

VIVILLE P, SOLOUKHIN V, KHOUSAKOUN E, DELIGNE N, COPPEE S, GRIVEI E, LAZZARONI R