国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C09D（4）
IPC C25D005/54（4）
发明人 LAI Z（2）
公开年
申请年
专利权人

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Forming electroplated copper on non-metallic material surface by preparing graphene-based electroplating ink, spraying ink on surface of non-metallic material, drying, soaking material in electroplating solution and applying current.

GU G, ZHANG G, LAI Z

Graphene heat dissipation coating comprises electrically treating graphene, silicon oxide nanofiber material and nano copper particles, nano copper particles are deposited by electrodeposition in composite material formed.

CHEN W, ZHOU M