国家/地区 世界知识产权组织（2）
IPC部 B（3）
IPC大类 C09（3）
IPC小类 C09D（3）
IPC B32B033/00（2） C09D005/00（2） C09D175/04（2）
发明人 WU K（2）
公开年 2021（2）
申请年 2021（3）
专利权人 HEWLETTPACKA.（2）

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Keyboard backlight module has main portion comprising light-shielding film, light guide film, light-reflecting film and forwarding packaging engine laminated in sequence, where light-shielding film, light-reflecting film and/or forwarding packaging engine are provided with thermally conductive layer.

DING J, FENG J, DING M