国家/地区 美国（3）
IPC部 C（3） H（3） B（2）
IPC大类 C09（3）
IPC小类 C09D（3）
IPC C09D005/00（2） C09D007/61（2） C09D175/04（2）
H05K009/00（2）
发明人
公开年 2021（3）
申请年 2021（3）
专利权人

Electromagnetic interference shielding material useful for EMI shielding applications on electronic devices and circuit boards, comprises biopolymer or polymer dissolved in organic solvents, and shielding guest materials comprising particles, powders, tubes or rods, flakes, fiber or sheets.

GROTE J G, SALOUR M M, ZANG D Y

Invisible ice-covering-proof compatible material useful as surface material of equipment, comprises insulating and heat insulating layer comprises e.g. polyimide, glass fiber, hollow glass microsphere and/or polyurethane and patterned heating, insulating heat conducting and hydrophobic layer.

MA Z, ZHAN X, WANG Z, ZHAO Z, ZHU Y, CHEN J, LIU X, CHEN H

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K