国家/地区 中国（4）
IPC部 C（4）
IPC大类 C21（4）
IPC小类 C21D（4）
IPC C21D001/26（4）
发明人
公开年 2021（4）
申请年 2020（2）  2021（2） 
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Method for reducing resistivity of single crystal copper wire, involves annealing single crystal copper under non-oxidizing gas and protective gas atmosphere, introducing carbon-containing gas into copper wire, reacting and cooling.

NOVOSELOV K

Preparing giant magneto-impedance effect graphene/nanocrystalline composite material comprises e.g. placing iron-based amorphous strip in tubular furnace, annealing to obtain iron-based nanocrystalline strips, and placing in quartz boat.

SONG Y, ZHAO Z, SUN Z, CHEN Y

Preparing graphene metal composite plate comprises e.g. polishing outer surface of metal plates using grinding machine, soaking in diluted hydrochloric acid solution, heating, clamping, coating graphene, extruding and rolling.

BAO Z, HUANG W, XU L, LI D, LI W, AN J