国家/地区 中国（5）
IPC部 B（5）
IPC大类 C21（5） C22（5） B22（4）
B21（3） H01（2）
IPC小类 C21D（5）
IPC C21D009/52（5）
发明人
公开年 2021（5）
申请年 2021（4） 
专利权人

Graphene bonded silver wire for packaging, comprises specified amount of graphene and silver.

PENG X, PENG S

Preparation of copper infiltrated wire involves mixing nickel, manganese, iron, zinc, and copper, adding mixture into vacuum melting furnace, molding alloy solution, forging and turning alloy ingots in electric furnace, hot rolling alloy bars into discs, drawing disc, and cutting alloy wire.

ZHOU B, TIAN D, GUO C, SUN J, WANG Q, LIU X, GOU S, LIU Q, LIANG X

High-strength alloy plate comprises nickel, silicon, molybdenum, lithium, magnesium, yttrium, platinum, rhenium, bismuth, tellurium, zirconium, and copper.

GE P, GUO D, HE W

Preparation of graphene-aluminum composite material lead by mixing magnesium oxide and graphene, soaking, liquid nitrogen ball milling, vacuum drying, roasting, adding magnesium oxide and atomized aluminum, casting, stretching and annealing.

JIA T, HONG W, ZHOU R, XI X, YANG F, LI M

High strength high conductivity graphene-copper composite wire comprises graphene, impurity element and copper.

YANG Z, FENG X, XIE H, PENG L, HUANG G, ZHANG W, MI X