国家/地区 中国（4）
IPC部 C（4）
IPC大类 C25（4）
IPC小类 C25D（4）
IPC C25D003/38（2）
发明人 CHEN Y（2） HE W（2） WANG C（2）
WANG S（2） ZHOU G（2）
公开年 2022（2）
申请年 2022（2） 
专利权人 UNIV CHINA ELECTRONIC SCI TECHNOLOGY（4）

Peeling layer useful for preparing ultra-thin copper foil, comprises barrier layer on carrier copper foil, conductive layer on barrier layer, and crystalline layer on the conductive layer, and the ultra-thin copper foil is formed on crystalline layer.

CHE S, XIANG C, GAO Y, SU X, HE W, WANG S, CHEN Y, ZHOU G, HONG Y, LIU X, WANG C

Synthesizing transition metal carbide nano-array comprises e.g. growing transition metal oxide with nano-array structure on substrate to obtain transition metal oxide nano-array, processing graphene nanosheets loaded on metal oxide template, and reacting graphene with metal oxide.

XIA X, LI C, ZHANG Y

Preparation of black hole liquid for printed circuit board, involves taking graphite plate, titanium plate or graphite plate, using ultra-pure water or aqueous ammonia as electrolyte, electrolyzing, adding conductive agent and adhesive.

WU Z, XIAO C, MO S, LIN J, SUN Y

Through-hole plating method for printed circuit boards, involves grafting graphene oxide with gamma-aminoethylaminopropyltrimethoxysilane to give product, adsorbing product of active metal ions, and electroplating.

CHEN Y, WANG Y, LI Q, HE W, WANG C, WANG S, ZHOU G, WANG Q, AI K, HU Z