国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5） H05（2）
IPC小类 C25D（5）
IPC C25D005/54（3） C25D007/00（2） C25D013/02（2）
C25D013/20（2）
发明人 LU J（5）
公开年 2023（3）
申请年 2021（3） 
专利权人 CHINESE ACAD.（3）

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Preparing high-strength layered titanium-based composite material comprises e.g. adding graphene oxide prepared by Hummers method into ethanol, ultrasonically dispersing, adding aluminum nitrate and mixing.

HUO W, ZHANG Y, DONG L, LU J, LIU Y, LIU L, WU H, LEI C

Preparing flexible transparent high electric conduction graphene film, by performing electrophoretic deposition to prepare graphene film on anode surface by graphene solution, immersing in acetone, and subjecting to heat treatment.

LU J