国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D003/38（3）
发明人 WANG J（3）
公开年
申请年 2021（2） 
专利权人

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N

Electronic component three-dimensional (3D) printing device based on selective electro-deposition comprises x-axis moving device, y-axis moving device, and z-axis moving device which are all mounted on mounting support.

WU W, WANG J, GUO J, LIU T, ZHAO J