国家/地区 中国（4）
IPC部 C（4）
IPC大类 C25（4） H05（2）
IPC小类 C25D（4）
IPC C25D005/54（3） C25D009/04（2） H05K003/42（2）
发明人 ZHANG J（4）
公开年 2021（4）
申请年 2020（3） 
专利权人 CHINESE ACAD.（2）

Method for treating substrate surface for electroplating flexible circuit board, involves pre-washing surface of substrate to be electroplated, and coating prepared graphene dispersion liquid on pre-washed substrate surface to be electroplated to form conductive layer for direct electroplating.

ZHENG K, CAO X, YE G, ZHANG J, MA Y

Processing substrate hole comprises e.g. pre-washing substrate, soaking pre-washed substrate in prepared graphene dispersion liquid, soaking liquid in hole structure, ultrasonically treating, drying to form conductive layer for direct plating.

CAO X, ZHENG K, YE G, ZHANG J, MA Y

Method for preparing reduced graphene oxide supported titanium dioxide film, involves placing reaction vessel containing mixed solution in oven, obtaining product after reaction of mixed solution, and cleaning and drying product to obtain titanium dioxide film.

ZHANG Y, SHU Z, ZHANG J, HU C, WANG Y, MA Y, ZHOU G, WANG S, SHEN X, LV J, ZHAO M

Coating graphene on surface of high-curvature copper powder comprises coating graphene-coated copper powder obtained by extracting mixed solution obtained by electroplating.

SHEN W, GUO S, YE L, ZHANG J, ZHONG M