国家/地区 中国（7）
IPC部 C（8） H（2）
IPC大类 C23（8） C25（8）
IPC小类 C23C（8）
IPC C23C028/00（8）
发明人 GUO C（4） LAI H（4） CHEN M（3）
XIA L（2）
公开年 2021（8）
申请年 2021（8）
专利权人 GUANGZHOU UL.（3）

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

High corrosion resistance zinc cobalt alloy coating structure of aluminum alloy piece, has trivalent chromium passivation layer and hydroxyl graphene sealing layer which are prepared in turn from inside to outside of substrate.

CHEN M, LAI H, GUO C

High corrosion resistant coating structure of galvanized iron alloy of cast iron piece, has silane chromium-free passivation layer that is formed by solvent silane passivation agent.

CHEN J, GUO C, LAI H

Blade comprises metallic substrate and coating system atop the substrate at the tip and comprises first layer of nickel, abrasive layer, comprises matrix and abrasive is partially embedded in the matrix.

JOOST W J, MAALOUF F S, MARTEL N T

Zinc-cadmium alloy composite coating for aerospace electrical component, comprises chemically deposited zinc layer, nickel plating layer, zinc-cadmium alloy plating layer, silane chromium-free passivation layer and graphene sealing layer, which are arranged on surface of aluminum alloy substrate.

LAI H, GUO C, CHEN M, XIA L

Surface environmental protection processing technology for aluminum products used for curtain wall materials, involves performing degreasing treatment of aluminum veneer, adding sodium hydroxide solution, sodium phosphate, and gluconate.

CHEN S

Electroplating zinc-cadmium alloy and coating hydroxy-graphene modified electrophoretic paint comprises preparing zinc-cadmium alloy coating, phosphating layer and hydroxy-graphene modified electrophoretic paint coating.

GUO C, LAI H, CHEN M, XIA L

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E