国家/地区 中国（3） 欧洲专利局（EPO）（2） 日本（2） 韩国（2） 美国（2）
IPC部 C（4）
IPC大类 C01（4）
IPC小类 C01B（4）
IPC C25D003/38（4）
发明人
公开年 2021（3）
申请年 2021（4）
专利权人

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Preparing graphene/copper composite powder for composite material for e.g. heat sink material, by mixing acidic solution containing copper ions and aqueous graphene solution or mixing acidic solution containing copper ions and aqueous graphene oxide solution, electro-depositing, and collecting.

WANG L, YU J, ZONG Y

Producing composite material used for e.g., electrocatalysis by impregnating a two-dimensional (2D)-material based aerogel with impregnation solvent, performing a solvent/water exchange, performing precursor diffusion and passing a current.

YANG W, MOISSINAC F, BARG S, BYUN J J, FRANCIS M, BARGZUELEN, GRADE S