国家/地区 中国（4）
IPC部 C（4）
IPC大类 C25（4） H01（3） C09（2）
C23（2）
IPC小类 C25D（4）
IPC C25D005/00（4）
发明人
公开年 2021（2）
申请年 2020（3） 
专利权人

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H

Connector e.g. male connector, comprises electrical contact material containing metal base material and conductive coating layer containing phase made of metal other than gold, and phase made of gold or non-metallic conductive material.

KUBO T, OKADA M, SHIMIZU T, KAWAI H, KAWAI Y

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Nano thermoelectric active material for three dimensional flame electric fireplace, comprises silica, parylene, polytetrafluoroethylene, thermoelectric materials, carbon nanotubes, bismuth, antimony, porous materials and graphene.

ZHANG D, LI J, SHI Z, LIU J