国家/地区 中国（3）
IPC部 B（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D005/54（3）
发明人
公开年 2021（2）
申请年 2021（3）
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Composite material comprises copper matrix and graphene and carbon nanotubes oriented distributed in the copper matrix.

YANG M, LI T, LIU W, WANG Y, HOU H