国家/地区 世界知识产权组织（2）
IPC部 C（3） B（2） G（2）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D013/06（3）
发明人 CHANG C H（2） WU K（2）
公开年
申请年
专利权人 HEWLETTPACKA.（2）

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Cover for electronic device comprises metal cover substrate, transparent passivation layer on top surface of substrate, water-borne graphene coating layer on transparent passivation layer, and electrophoretic deposition coating layer.

WU K, CHANG C H, HSIEH H

Producing composite thin film material, comprises preparing graphene oxide hydrosol, mixing with surfactant, adding reducing agent, reducing and oxidizing to obtain redox graphene oxide hydrosol, and carrying out electrodeposition method.

ZHANG D, LIU L