国家/地区 中国（4）
IPC部 C（5）
IPC大类 C25（5） H05（5）
IPC小类 C25D（5）
IPC H05K003/42（5）
发明人 CAO X（2） MA Y（2） YE G（2）
ZHANG J（2） ZHENG K（2）
公开年 2021（5）
申请年 2020（2）  2021（2） 
专利权人 CHINESE ACAD.（2）

Method for treating substrate surface for electroplating flexible circuit board, involves pre-washing surface of substrate to be electroplated, and coating prepared graphene dispersion liquid on pre-washed substrate surface to be electroplated to form conductive layer for direct electroplating.

ZHENG K, CAO X, YE G, ZHANG J, MA Y

Processing substrate hole comprises e.g. pre-washing substrate, soaking pre-washed substrate in prepared graphene dispersion liquid, soaking liquid in hole structure, ultrasonically treating, drying to form conductive layer for direct plating.

CAO X, ZHENG K, YE G, ZHANG J, MA Y

Graphene sheet/carbon black composite black hole liquid useful in printed circuit board, comprises graphene sheet, carbon black, surfactant, aqueous high molecular polymer, potassium hydroxide solution and deionized water.

WANG J, LI Z, CAO L, BAI J, FANG B, HAO L

Preparation of black hole liquid for printed circuit board, involves taking graphite plate, titanium plate or graphite plate, using ultra-pure water or aqueous ammonia as electrolyte, electrolyzing, adding conductive agent and adhesive.

WU Z, XIAO C, MO S, LIN J, SUN Y

Conductive slurry for plating circuit board, comprises carbon material containing carbon nanotube and/or graphene, dispersant and binder, which are uniformly mixed in solvent.

CHIU C, HUANG C