国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3） H05（3）
IPC小类 C25D（3）
IPC H05K009/00（3）
发明人
公开年
申请年
专利权人

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Preparing flame-retardant omni-directional conductive sponge material comprises placing sponge substrate into pre-soaking liquid, subjecting into electroplating solution, and plating electroplated sponge substrate with conductive cloth.

LIU W