国家/地区 世界知识产权组织（3） 美国（2）
IPC部 B（3）
IPC大类 C25（3） C23（2）
IPC小类 C25D（3）
IPC C25D011/02（2） C25D013/06（2）
发明人 WU K（3） CHANG C H（2）
公开年
申请年
专利权人 HEWLETTPACKARD DEV CO LP（3）

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Cover for electronic device comprises metal cover substrate, transparent passivation layer on top surface of substrate, water-borne graphene coating layer on transparent passivation layer, and electrophoretic deposition coating layer.

WU K, CHANG C H, HSIEH H

Multi-layered sheet for use as housing for electronic devices, has graphene-based barrier coating that includes specified amount of graphene and is formed on micro-arc oxidized layers and has prescribed thickness.

WU K, CHANG C, CHEN W