国家/地区 中国（6）
IPC部 B（6）
IPC大类 B05（6） C25（6） B82（3）
C01（3） C23（3） H01（3）
IPC小类 B05D（6）
IPC B05D005/12（6）
发明人
公开年 2021（2）
申请年 2020（2） 
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Preparation of conductive anti-corrosion coating layer involves polishing magnesium alloy, performing micro-arc oxidation treatment, coating conductive anti-corrosion coating prepared using e.g. polypyrrole conductive material and epoxy resin, on surface of micro-arc oxidation layer, and drying.

LIU M, CHANG L, ZHU S, WANG L, GUAN S

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Acrylonitrile-butadiene-styrene engineering plastic surface metal layer comprises antioxidation layer containing conductive filler, reducing filler and aqueous acrylic resin emulsion, semi-light nickel layer, and anticorrosive layer.

FANG J, XIONG Z, CHENG G

Method for manufacturing electrical conductor, involves depositing boundary cappings on defects of graphene layer to inhibit corrosion of the substrate layer at defects and depositing boundary capping material on substrate layer.

LIU Z, ZHENG M, MARTENS R I, MARTENS R

Method for isolating graphene thin film involves causing graphene thin film and polymer-based coating to be released from catalyst thin film, after curing polymer-based coating.

VEERASAMY V S, VEERASAMY V