国家/地区 中国（5） 美国（3） 世界知识产权组织（3） 韩国（2）
IPC部 C（7）
IPC大类 C25（7） C01（3） B82（2）
IPC小类 C25D（7）
IPC C25D003/38（7）
发明人 JIE X（2） JO T（2） JO T J（2）
KIDEOK S（2） LEE S（2） LEE S H（2）
MAI Y（2） PARK S（2） SEULKI P（2）
SONG K（2） SONG K D（2） SUNHYOUNG L（2）
TAE J J（2） ZHANG L（2） ZHOU M（2）
公开年 2017（5） 2018（2）
申请年 2017（7）
专利权人 ILJIN MATERI.（2） UNIV GUANGDO.（2）

Method of obtaining nano doubled copper film modified by graphen comprises, mixture of graphene fraction with aqueous solution of polyacrylic acid in weight ratio of water.

KONAKOV V G, ARCHAKOV I YU, KURAPOVA O YU

Preparing self-supporting reduced graphene oxide coating involves taking brass sheet as cathode and copper sheet as anode in composite plating solution, adding phosphoric acid to adjust pH value and applying pulse current.

ZHOU M, MAI Y, JIE X, ZHANG L

Electrolytic copper foil used for producing graphene, has preset ratio of surface roughness of copper foil and surface roughness of copper foil after heat treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Electrolytic copper foil used for forming graphene during fabrication of semiconductor component for computer, electronic paper and display, has preset tensile strength before and after subjecting to heat-treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Producing copper-based self-lubricating composite coating involves subjecting ultrasonic dispersion of carboxylated carbon nanotube and/or graphene polystyrene in aqueous solution of composite surfactant to form dispersion liquid.

ZHOU M, MAI Y, JIE X, ZHANG L

Production of graphene film used in nanoelectronics, involves forming catalyst film on conductive support, forming graphene film on catalyst film, and electrolytically removing catalyst film from support.

BOTTE G G

Preparation of graphene-based steel alloy involves selecting steel metal substrate and washing, carrying out surface activation process and performing nickel plating process, carrying out chemical vapor deposition process, and cooling.

JI Y, CHENG S, LI F, YU Y