国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D005/02（3）
发明人
公开年 2021（2）
申请年 2021（3）
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Composite processing method for flexibly customizing high adjustable flexible micro-heater, involves using selective electrochemical deposition material to deposit on heating pattern region, and packaging flexible polymer as packaging layer to finish manufacture of flexible microheater.

YANG Y

Electronic component three-dimensional (3D) printing device based on selective electro-deposition comprises x-axis moving device, y-axis moving device, and z-axis moving device which are all mounted on mounting support.

WU W, WANG J, GUO J, LIU T, ZHAO J