国家/地区 中国（4）
IPC部 C（4）
IPC大类 C23（4）
IPC小类 C25D（4）
IPC C25D003/38（4）
发明人 HE P（2） YANG D（2） ZHANG Z（2）
公开年 2020（3）
申请年 2019（4）
专利权人 CHINA DONGFA.（2）

Preparing low-temperature hydrophobic heat exchange material based on stainless steel and graphene comprises e. g. plating copper or nickel on surface of stainless steel and performing chemical plating or electroplating.

ZHANG Z, YANG D, HE P

Preparing stainless steel composite material for condensation heat exchange, involves plating copper or nickel on the surface of stainless steel, using electroless plating or electroplating, preparing graphene hydrophobic coating.

ZHANG Z, YANG D, HE P

Preparing copper or graphene-plated magnesium alloy composite material involves insulating aluminum and zinc, smelting aluminum after heat preservation is completed, and adding zinc to aluminum melt and mixing, and melting zinc.

ZHOU L, LI X, WANG X, YI J, ZHANG X, ZHOU X

Graphene-containing PCB copper composite plating solution includes a copper ion source, where the copper ion source is preferably copper chloride, copper sulfate, the content of the copper ion source is 55-95g/L, sulfuric acid is preferred.

LI A