国家/地区 日本（2）
IPC部 C（3）
IPC大类 C23（3）
IPC小类 C25D（3）
IPC C01B031/02（2）
发明人
公开年 2013（3）
申请年 2011（3）
专利权人 JX NIPPON MI.（2）

Resin plating method during manufacture of e.g. electronic equipment, involves forming graphene thin layer on resin substrate by applying expanded graphite dispersion to resin substrate and electroplating resin substrate.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S

Copper foil for manufacture of graphene for e.g. transparent electrode, conductive thin film of display element, mercury-free fluorescent lamp and carrier of drug delivery system, includes specified amount of preset plane on surface.

KOBIKI T, SAKAGUCHI K, KOHIKI M

Copper foil used for graphene manufacture, consists of copper plating layer containing hydrogen in ratio above preset value, and having glossiness above preset value in rolling parallel direction and right angle direction.

CHIBA Y