国家/地区 中国（3）
IPC部 C（3）
IPC大类 C23（3）
IPC小类 C23C（3）
IPC C25D005/54（3）
发明人
公开年 2022（2）
申请年 2022（3）
专利权人

Method for metallizing surface of graphene film in electronic device, involves plating metal adhesive layer on surface of graphene film base body by magnetic control sputtering method, and plating metal plating layer on surface of metal adhesive layer by electroplating method.

LIAO Q, LI Y, XU L, JI H, WANG X, MA S, ZHANG Y

Highly conductive graphene-pretreated electroplated metal fibers, comprises graphene oxide layer provided on outside of non-woven fabric, outside of metal nickel layer provided with electroplated copper layer, and protective nickel layer provided on outside of electroplated copper layer.

HU T, FANG R

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J