国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D005/00（3）
发明人
公开年 2023（3）
申请年
专利权人

Preparation of magnesium alloy ultrasonic electrodeposition nano-nickel-based composite layer involves connecting magnesium alloy sample as negative electrode, and nickel plate as positive electrode respectively with pulse power supply, soaking in electroplating solution, and electrodepositing.

HU D, LI Z

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K