国家/地区 中国（9）
IPC部 C（9）
IPC大类 C23（9） C25（9） H01（2）
IPC小类 C23C（9）
IPC C23C028/00（9）
发明人 GUO C（5） LAI H（5） CHEN M（3）
XIA L（2）
公开年 2021（9）
申请年 2021（7）  2020（2） 
专利权人 GUANGZHOU UL.（4）

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

High corrosion resistance zinc cobalt alloy coating structure of aluminum alloy piece, has trivalent chromium passivation layer and hydroxyl graphene sealing layer which are prepared in turn from inside to outside of substrate.

CHEN M, LAI H, GUO C

High corrosion resistant coating structure of galvanized iron alloy of cast iron piece, has silane chromium-free passivation layer that is formed by solvent silane passivation agent.

CHEN J, GUO C, LAI H

Zinc-cadmium alloy composite coating for aerospace electrical component, comprises chemically deposited zinc layer, nickel plating layer, zinc-cadmium alloy plating layer, silane chromium-free passivation layer and graphene sealing layer, which are arranged on surface of aluminum alloy substrate.

LAI H, GUO C, CHEN M, XIA L

Surface environmental protection processing technology for aluminum products used for curtain wall materials, involves performing degreasing treatment of aluminum veneer, adding sodium hydroxide solution, sodium phosphate, and gluconate.

CHEN S

Electroplating zinc-cadmium alloy and coating hydroxy-graphene modified electrophoretic paint comprises preparing zinc-cadmium alloy coating, phosphating layer and hydroxy-graphene modified electrophoretic paint coating.

GUO C, LAI H, CHEN M, XIA L

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Protective layer structure of non-cyanide cadmium plating and electrophoretic painting comprises metal substrate, non-cyanide cadmium plating layer, phosphate layer and electrophoretic paint coating comprising hydroxyl graphene material.

GUO C, PENG C, LAI H

Connector e.g. male connector, comprises electrical contact material containing metal base material and conductive coating layer containing phase made of metal other than gold, and phase made of gold or non-metallic conductive material.

KUBO T, OKADA M, SHIMIZU T, KAWAI H, KAWAI Y