国家/地区 中国（4）
IPC部 C（4）
IPC大类 C25（4）
IPC小类 C25D（4）
IPC C25D005/50（4）
发明人
公开年 2021（4）
申请年 2021（3） 
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Method of preparing anode electrophoresis paint mediated electrochemical assembling graphene radiating layer, involves performing thermal reduction treatment to obtain anode electrophoretic paint mediated electrochemical assembling graphene radiating layer.

ZHAO W, JIANG Y, WENG Y, DENG Y

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y

Nanoparticle doped porous graphene/rare earth multi-layer composite silane film used for surface treatment of metal material comprises silane coupling agent, ethanol, water, porous graphene and rare earth salt.

TANG J, YAO Y, LI Y, JIANG J, GUO M, SUN R, HUANG X, CONG H, KONG Y, HAN S