国家/地区 韩国（4）
IPC部 F（4）
IPC大类 F28（4） B32（2）
IPC小类 F28D（4）
IPC F28F021/06（2）
发明人
公开年 2022（4）
申请年 2020（2）  2021（2） 
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Heat exchanger for wastewater, has module block that is assembled on surface of heat transfer plate, and is fitted in arbitrary area of irregularities formed at regular intervals over entire area of transfer plate.

HO H M

High thermal conductivity and low gas permeability fluororesin tube useful for heat exchanger comprises fluororesin, thermally conductive flat filler and filler in form of nano-sized thermally conductive fibers.

CHOI J H

Uni electric boiler for heating water, has control unit that controls selectively turn on multiple high-efficiency electric heaters, multiple circulation pumps, and multiple control devices according to user's setting.

PARK J Y