国家/地区 中国（6） 韩国（3） 世界知识产权组织（2）
IPC部 F（9）
IPC大类 F28（9） H01（4） H05（4）
B22（2） G06（2）
IPC小类 F28D（9）
IPC F28D015/02（4） F28D015/04（3） F28F021/02（3）
B22F003/00（2） B22F003/03（2） B22F003/10（2）
F28D017/02（2） G06F001/20（2） H01M010/617（2）
H01M010/623（2） H01M010/6555（2） H05K007/20（2）
发明人 HA J S（2） HAJUNSEOK（2） LEE S H（2）
RHO H K（2） RYU H S（2） ZHENG Z（2）
ZHONG M（2）
公开年 2023（6） 2022（3）
申请年 2022（9）
专利权人 LAUREL ELECT.（2） UNIV CHONNAM.（2）

Graphene coating PTC constant temperature heater, has lifting component comprising stepping motor, screw thread screw rod, lifting seat and bearing seat, where surface of water tank is provided with guide component.

YANG C, SHENG W

Vapor chamber for use in e.g. electronic device, has sealing parts formed along edges of opposite surfaces of upper and lower plates, and porous metal fiber sheet provided between upper plate and lower plate and filled with low boiling point fluorohydrocarbon.

HUN L S, KIMTAEHAN

Device for recycling low temperature waste heat freezing liquid, has heat conducting glue layer that is surrounded on inner surface of graphene layer, and inner layer surrounded on surface of glue layer.

SUN S, PENG W

Manufacturing heat spreader with metal graphene composite structure, by manufacturing heat panel by forming metal powder layer by spraying metal powder on prepared metal substrate, and heating and injecting graphene fuel to form a heterostructure, and shaping heat panel.

LEE S H, RHO H K, RYU H S, HA J S, HAJUNSEOK

Metal graphene composite structure heat pipe has porous wok in which graphene layer is formed on surface of inner pores, and metal plating layer formed on outer surface of porous wok by metal plating of porous wok.

HA J S, RHO H K, RYU H S, LEE S H, HAJUNSEOK

Boiling device with crack-shaped quantum graphene film as substrate, has boiling radiating system supported by supporting column, and condenser is connected with first side end of boiling cavity through liquid flow pipe.

TAO P, SHANG W, SONG C, DENG T, FU B, CHU B

Uniform temperature device, has base plate comprising first surface and second surface opposite to first surface, heat conducting piece arranged on first surface of substrate, and radiation layer arranged on second surface.

ZHONG M, ZHENG Z

Uniform temperature device i.e. stacked uniform temperature equalizing device, has set of heat conducting pieces arranged on first surface of base plate, and radiation layer arranged on second surface of plate.

ZHONG M, ZHENG Z

Directional hydrophobic structure for electronic packaging drainage device, has directional hydrophobic spacer that is arranged on substrate, and micro-grooves that are discharged into packaging mold along tapered micro-pillars.

LI B, GUO Y, XIE B, WEN G, CHEN Y, OU Z, HOU M