国家/地区 美国（4）
IPC部 F（4）
IPC大类 F28（4） H05（4） H01（3）
G06（2）
IPC小类 F28D（4）
IPC H05K007/20（4）
发明人
公开年 2021（4）
申请年 2020（3） 
专利权人

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Method for manufacturing diamond-graphene hybrid thermal management material, involves converting predetermined thickness of partial area of one side or both sides of diamond base material into vertical graphene, where diamond base material serves as heat spreader.

JU H, LEE J K, SU J

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Phase change composite useful in a heat spreader, comprises a structure in which phase change material unit layers and thermal conductive layers are sequentially laminated.

KIM D R, HEU C S, KIM S H, LEE H S, SON H W, KIM D, HO K S, LEEHEUNGSOO