国家/地区 世界知识产权组织（4）
IPC部 F（4）
IPC大类 F28（4）
IPC小类 F28D（4）
IPC
发明人
公开年 2022（4）
申请年 2020（4）
专利权人

Heat exchange system for cooling building, has device that is implanted in subsoil of earth and is connected to device implanted in building by connecting pipes, and circulation pump that is provided for circulating fluid in closed circuit, where fluid is provided with capsules.

DURAND I, BOULHARTS H, BOURBIAUX B, ESNAULT V, LECOMTE J, LEONTIDIS V, MARSIGLIA M, SANZ E, ISABELLE D, HABIBA B, BERNARD B, VIVIEN E, JEANFRANCOIS L, VLASIOS L, MARIE M, ELENA S

Porous 3D graphene structure used as porous wick medium in thermal systems such as vapor chambers or heat pipes used in electronic devices to enhance thermal performance.

KOSAR A, KAYA I I, SADAGHIANI A K, APAK A, APAK A M, PARLAK M, TASTAN U, BOENCUE M

Apparatus for improving flow in pipelines, has air gap that provides upward movement of polyethylene terephthalate (PET) layer using opposite forces of alternate sides of PET layer, and configuring graphene layer to surround shell.

RAYNEL G R J, VILLETTE T T

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H