国家/地区 美国（3） 中国（2） 日本（2） 韩国（2）
IPC部 B（4）
IPC大类 C08（4）
IPC小类 C08K（4） B82Y（3） C09D（3）
C01B（2） C08F（2） C08L（2）
C09C（2） H01L（2）
IPC C08K003/04（4）
发明人
公开年 2012（4）
申请年 2011（2）  2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Recording material used for ink jet printing, comprises coating containing oxidized graphite alkene/polyacrylic acid copolymer ink absorbing layer, where copolymer comprises double bond graphene oxide, acrylic acid, water and initiator.

BU H, HAN J, HUANG Y, JIANG Z, LIU L, ZHANG Y, LI J

Solubilizing allotropes of carbon comprises providing a solute of fullerene, graphene or polymer of fullerene, combining with terpene, lactone or alcohol; providing cavitation, and ultracentrifuging to yield a true solution.

ROSTRO B, KOHANLOO M

Resin composite material comprises synthetic resin and graphene-structured carbon material dispersed in synthetic resin, and has carbon material grafting rate in specific range.

INUI N, MUKOHATA D, NARUTA M, TSUMURA K, SAWA K, TAKAHASHI K, TANIGUCHI K, MUKAIHATA D, NARUTA W