国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C08（4） C01（2） C09（2）
IPC小类 C08K（4） C08L（4） C01B（2）
C08J（2） C09D（2）
IPC C08K003/04（4）
发明人
公开年 2013（4）
申请年 2011（2）  2012（2） 
专利权人 UNIV ULSAN F.（2）

Composition useful for a lead-free solder, which is used for manufacturing solder joint product and electronic components, comprises silver, reduced graphene oxide and epoxy resin.

HUR S H, VANHOANGLUAN, HUYNHNGOCTIEN, KONG B S

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Reforming method of graphene used for manufacturing composite nanomaterial, involves dispersing graphene into alcohol, stirring and heating dispersed graphene under presence of highly-acidic catalyst.

KWAK S B, RAK L S, RYUL J S, YUN L S, EON M S, SANG H D, MO J H, MIN O S, MIN O G, LEE S R, JU S R, LEE S Y, MOON S E, HAN D S, JEONG H M, OH S M, OH K M