国家/地区 世界知识产权组织（5）
IPC部 C（4） H（3）
IPC大类 C08（4） H01（3）
IPC小类 C08K（4） C08L（3） H01L（3）
IPC C08K003/04（4） C08L027/12（2） H01L033/56（2）
发明人 CHEN J（5）
公开年 2017（5）
申请年 2017（3） 
专利权人 UNIV EZHOU I.（2） UNIV HUAZHON.（2） UNIV HUAZHON.（2）

Polypropylene composition comprises polypropylene resin, high-density polyethylene resin, dendritic toughening agent, graphene, and surface modifier.

WU Z, WANG D, HUANG X, YE N, CHEN J, YE S, LEI L, YANG B, LUO Z, ZHANG C, DING Z

Fluororesin interface agent for light emitting diode package, comprises graphene oxide-fluorine resin sealant and KH550 silane coupling agent solution, where graphene oxide-based resin sealant comprises graphene oxide dispersion liquid.

CHEN J, DU S, LIANG R, WANG S, XU L, ZHANG J

LED package includes substrate, LED chip, sealant layer and quartz glass that are arranged in turn where sealant layer contains graphene oxide-based fluororesin sealant layer that comprises graphene oxide dispersion and fluororesin matrix.

CHEN J, DU S, LIANG R, WANG S, XU L, ZHANG J, WANG H

Electrically conductive composite material used as mixture for electrically conductive composite used for article comprises carbon nanotubes and graphene nanoplatelets within polymer matrix.

CHEN J, KOZIOL K K, PAUKNER C

Thermal interface element of heat exchange system for cooling hot spots on chip, has array of carbon nanotubes that is formed between graphene sheets, and is covalently bonded via carbon-carbon bonds to graphene sheet.

KOUMOUTSAKOS P, CHEN J, WALTHER J H