国家/地区 香港（7）
IPC部 C（5） H（4）
IPC大类 C01（4） H01（4）
IPC小类 C01B（4） H01L（3）
IPC C01B000/00（3） H01L000/00（3） C01B032/194（2）
H01L023/00（2） H01L023/31（2） H01L023/367（2）
H01L023/373（2）
发明人 KE L（2） LEUNG S（2） LIANG S（2）
MATSUBARA Y（2） OR L（2） SITU R（2）
SZETO Y（2）
公开年 2017（7）
申请年 2017（5）  2016（2） 
专利权人 KE L（2） LEUNG S（2） LIANG S（2） OR L（2）
RENESAS ELEC.（2） SITU R（2） SZETO Y（2）

Calcium silicate board comprises graphene, calcium material, silicon material, reinforced fiber and water glass, in specified weight ratio.

TONG S

Graphene infrared sensor i.e. quantum sensor, has photonic crystal layer formed in remaining part of upper surface of electrode layer, in upper surface of material layer and in remaining part of upper surface of silicon wafer.

LAI W, LO W, TANG X, POON C, CHENG W

Semiconductor device e.g. CPU, has heat dissipation unit fixed on semiconductor chip, and fin comprising graphene and arranged on semiconductor chip such that graphene is arranged in direction crossing surface of semiconductor chip.

MATSUBARA Y

Embedded ion of three lattice graphene carrier comprises thirteen carbon atoms, where thirteen carbon atoms bonded to each other to form a three-crystal hexagonal graphene structure in which nine carbon atoms combine with carbon atoms.

KE L, LIANG S, SITU R, OR L, LEUNG S, SZETO Y

Seven-lattice graphene carrier with embedded ion comprises four carbon atoms which are key combination to form seven hexagon-lattice graphene structure, where twelve carbon structure is formed by combining two carbon-carbon double bonds.

KE L, LIANG S, SITU R, OR L, LEUNG S, SZETO Y

Production device used for producing carbon nano material e.g. graphene nano material, has carbon nano control device that is arranged on carbon nano-vacuum device such that carbon nano-vacuum device is controlled.

HO T, HO T K, HE Z

Semiconductor device, has resin material that is provided for covering semiconductor chip which is coupled onto substrate through bump electrode and that is provided for containing resin and graphene particles.

MATSUBARA Y, YOSHIHISA M