国家/地区 世界知识产权组织（3）
IPC部 C（2）
IPC大类
IPC小类
IPC
发明人 LEE H W（2）
公开年 2020（3）
申请年 2019（3） 
专利权人 MIMOS BERHAD（3）

Method of forming graphene bump structure, involves synthesizing graphene layer on top of metal catalyst layer, depositing epoxy-based photoresist, and removing thin metal catalyst, silicon dioxide and photoresist layers from substrate.

LEE H W, LEE M W, BIN MOHAMMAD HANIFF M, BINTI SORIADI N, BIN ADOM A H

Synthesizing solvent-free conductive ink for printing film, by mixing graphene oxide in water, ultrasonically processing, adding quaternary ammonium compound and silver nitrate, centrifuging, rinsing with deionized water and mixing.

NORAZAH BT A R, SURAYA BINTI S, AIMAN SAJIDAH BINTI A A, LEE H W

Forming bernal-stacked graphene layers involves depositing metal layer with grain boundary on substrate, performing direct-annealing the metal layer to remove impurities and recrystallise metal layer in form of groove-like structure.

MOHAMMAD HANIFF M A, MD YAKIN F S, SYONO M L