国家/地区 中国（3） 美国（2）
IPC部 C（5）
IPC大类 C25（5） H01（2）
IPC小类 C25D（5）
IPC C25D005/18（5）
发明人
公开年 2021（5）
申请年 2021（5） 
专利权人

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y

Producing composite material used for e.g., electrocatalysis by impregnating a two-dimensional (2D)-material based aerogel with impregnation solvent, performing a solvent/water exchange, performing precursor diffusion and passing a current.

YANG W, MOISSINAC F, BARG S, BYUN J J, FRANCIS M, BARGZUELEN, GRADE S

Fabricating non-enzyme sensor element used in non-enzyme sensor, involves printing conductive material on surface of substrate to form working, reference and auxiliary electrode, and printing porous carbon material on working electrode.

LIN Y, LIN S, CHEN Y, WANG H, WANG H Y, CHEN Y Y, LIN S H, LIN Y S

Preparing double-pulse electroplating nickel-graphene composite plating layer of continuous casting crystallizer comprises processing crystallizer copper plate before electroplating, and preparing graphene oxide solution by Hummers method.

FENG T