国家/地区 中国（5）
IPC部 C（7） H（3） B（2）
G（2）
IPC大类 C08（7） H05（2）
IPC小类 C08K（7） C08L（7） C08G（5）
C08J（5） H05K（2）
IPC C08L079/08（7）
发明人 LIAO B（3） QIAN X（3） ZHANG B（3）
公开年 2022（7）
申请年 2020（7）
专利权人 ZHUZHOU TIME.（3）

Preparing modified graphene/bismaleimide resin involves performing amination of graphene allyl phenol organic matter, thermoplastic resin and bismale imide monomer to polymerization reaction.

LI S, YANG H, ZHAO Z, LIU R

Manufacture of high heat-resistant ultra-low expansion polyimide film for e.g. electronics, microelectronics , optical display or optical communication field, by mixing raw material with solvent, filtering, vacuum defoaming, uniformly coating, and peeling substrate.

QIAN X, LIAO B, ZHANG B

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Preparing high temperature resistant polyimide useful for manufacturing flexible display substrate, comprises e.g. carrying out suction filtration and vacuum defoaming of polyamic acid resin solution, casting on casting plate, solidifying into adhesive film.

QIAN X, LIAO B, ZHANG B

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Producing polyimide aerogel used for three-dimensional model conveniently in various fields i.e. food, comprises e.g. preparing polyamic acid salt by dissolving diamine, dianhydride and tertiary amine-based photocuring agent in solvent.

CHUNG C M, CHOI Y J, CHOI J Y, JIN S W, PARK H J, SEUNGHYOUN L, LEE J S, LEE J, AHN H S, KIM D