国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人
公开年 2022（4）
申请年 2021（2）  2022（2） 
专利权人

Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.

CHEN M, LIU J, JIANG J

Polyphenylene sulfide conductive composite material used for medical appliance, comprises polyphenylene sulfide, carbon fiber, glass fiber, potassium titanate fibers, superconducting carbon black, graphene, and surface treatment agent.

LIU Q, DING W, CHEN J, TANG H

Composite material useful in electromagnetic shielding device, comprises carbon fiber base layer surface loaded with bonding layer surface formed with modified graphene oxide material layer.

SUN L, TIAN Y, MA H, LIU S, MA X

Preparing flexible electromagnetic shielding polyether sulfone film involves embedding treatment of conductive nano particles and magnetic nano particles, placing styrene maleic acid in sodium hydroxide solution, coating on glass plate or non-woven fabric, placing in water, taking out and cleaning.

CHANG J, QIN L, QIN S, SHAO H, WU X