国家/地区 世界知识产权组织（3）
IPC部 B（3）
IPC大类 B32（3） C08（2）
IPC小类 B32B（3）
IPC
发明人
公开年 2022（3）
申请年 2020（3）
专利权人

Composite material used for multilayer armor system, comprises thermosetting polymer reinforced with natural fiber.

NEVES MONTEIRO S, CAMPOSO PEREIRA A

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Anti-corrosive metal housing for electronic device has metal substrate, passivation layer including oxyanion e.g. molybdate, vanadate, and/or manganese salt, and sealing layer including e.g. sodium silicate, zinc powder, and/or clay powder.

LI Y, CHUANG Y C, WU K