国家/地区 世界知识产权组织（4）
IPC部 C（4）
IPC大类 C09（4） C08（3）
IPC小类 C09D（4）
IPC C09D175/04（4）
发明人 HUN L S（2） KIM T H（2） KIMTAEHAN（2）
LEE S H（2）
公开年 2022（4）
申请年 2021（4） 
专利权人 PUREMANN INC（2）

One-component urethane heat dissipation paint composition e.g. for coating heat dissipation coating film, comprises e.g. polyol, thermally conductive particles including graphite, additives, block diisocyanate and acetate-based solvent.

KIMTAEHAN, HUN L S, YOUK S K, YUMINSOOK, KIM T H, LEE S H, YU M S

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Coating agent useful for leather products, comprises e.g. polyurethane prepolymer, poly(methyl methacrylate) resin composition, carbon nanotubes, graphene, alkoxysilane, carnauba wax, filler, and 1,3,5-triglycidyl isocyanurate.

JUNGHWAN A, AN J H

Cooling of semiconductor component for e.g. heat sink, involves arranging metal layer between component and heat dissipation coating layer, forming coating layer by using heat dissipation coating composition containing urethane binder resin, and exfoliating thermally conductive particles.

KIMTAEHAN, HUN L S, CHOI S, SHIM Y, SONG J, KIM T H, LEE S H, CHOI S I, SIM Y H, SONG J H