国家/地区 美国（3）
IPC部 C（3） H（3） B（2）
IPC大类 C09（3）
IPC小类 C09D（3）
IPC C09D011/037（2） C09D011/52（2） H01L021/02（2）
H05K003/12（2）
发明人
公开年 2022（3）
申请年 2022（3）
专利权人

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Heating apparatus like stoves, comprises body, chamber defined by body, where chamber comprises upper region and lower region, and thermal plate that provides heat to chamber, where thermal plate comprises coating having thermo-resistive layer comprising polymeric portion and nanostructure portion.

KHIZAR M, FRACCON S

Composition for use in three-dimensional printing of electronic devices, comprises at least triphenylamine which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure.

GLENN C M