国家/地区 日本（9）
IPC部 C（9） H（5） B（3）
A（2） G（2）
IPC大类 C09（9）
IPC小类 C08K（5） C09D（5） C08L（4）
C08F（3） C09K（3） H01B（3）
H01M（3） C01B（2） C08G（2）
C09C（2）
IPC C08K003/04（5） C09D005/24（4） C09D007/61（4）
H01M004/04（3） C09C001/44（2） C09C003/10（2）
H01B013/00（2） H01M004/13（2） H01M004/139（2）
H01M004/62（2）
发明人
公开年 2022（9）
申请年 2022（9）
专利权人

Graphene material used in substrate for sustained release of non-aqueous component, having specific total porosity and open porosity.

MURAMATSU K, TAKAHASHI K, IWATA H, SUTANI K, YABUMOTO H, IWATA E

Manufacturing conductive pigment paste includes dispersing paste containing pigment dispersion resin, conductive pigment and solvent by at least one disperser selected from bead mills, homogenizers, ultrasonic dispersers, kneaders, extruders, and planetary mixers.

ENDO K, HASHIMURA M, KITAMURA T, YUKAWA Y, YUGAWA Y

Composition used for three-dimensional printing e.g. additive manufacturing, comprises particles comprising thermoplastic polymer grafted to carbon nanomaterial, and particles have preset aerated density.

FARRUGIA V M, SRISKANDHA S E, CLARIDGE R, SRISKANDAR S E, EMPARUZIA V, SIBANTIISWARISLISKANDA

Dispersant used in composition for forming conductive material slurry, comprises copolymer comprising an acrylate structural unit, vinyl-based structural unit, and acrylamide structural unit.

AKITO I, YUTARO K, KYOICHI S, IBI A, KINOSHITA Y, SHIROTA K

Paste for reference electrode used in biosensor, comprises mixture of silver chloride powder and carbon-based conductive material.

KANG Y J, JEONG I S, PARK C H, KIM S J, PARK Y B, PARK Y, KIM S, PARK C, JEONG I, KANG Y, CHONG I, JUN K S, CHEON I S

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Conductive polymer composition used for forming film, comprises polythiophene containing at least two structural units and carbon material.

KUDO K, KAWAKAMI J, SENNO Y

Powder coating composition used in manufacturing coating film which used in cookware such as frying pans, rice cookers, comprises first hot-melt fluoro resin particles which filler is dispersed in particles, second hot-melt fluoro resin particles and charge controlling agent particles.

NAKAZAWA R, TAKEYAMA M, PHAM H, KAMEYAMA S, PHAM H N

Aqueous coating liquid used for forming coating film, comprises water-containing aqueous medium containing water, polyvinyl alcohol-based resin, conductive material and 2-phosphonobutane-1,2,4-tricarboxylic acid.

HAYASHI T, KOBAYASHI M, KOBAYASHI N