国家/地区 台湾（39）
IPC部 C（39） H（21） B（12）
G（7） A（2）
IPC大类 C09（39）
IPC小类 C08K（20） C09D（19） C08L（18）
C09K（14） C08J（10） C09J（10）
H01L（10） C08G（9） H01B（9）
H05K（9） C08F（8） B32B（6）
C01B（6） B82Y（4） C09C（3）
IPC C08K003/04（14） C09J011/04（8） C08K003/22（7）
C09J163/00（5） C01B032/194（4） C08F220/18（4）
C08G077/455（4） C08K003/08（4） C08L063/00（4）
C08L075/04（4） C08L083/04（4） C08L083/05（4）
C08L083/07（4） C08L083/10（4） C09J009/02（4）
发明人 FUJIMOTO T（4） MANDAL S（4） ICHIKAWA I（3）
ISAO I（3） TAKEO Y（3） YOSHINOBU T（3）
BERHANE A（2） ESTRUGA O M（2） ESTRUGA ORTIGA M（2）
ESTRUGAORTIGAMARQUE（2） HATAKEYAMA J（2） HENCKENS A（2）
KONWAR D B（2） MILLER C（2） NARAYANAN R（2）
公开年 2022（39）
申请年 2021（25）  2020（7）  2022（7） 
专利权人 MOMENTIVE PE.（4） EINK CORP（3） LINTEC CORP（3） E INK CALIFO.（2）
HENKEL AG C.（2） SHINETSU CHE.（2）

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Fluoropolymer binder for lithium-ion battery, comprises mixture of phase of polytetrafluoroethylene formed of primary polytetrafluoroethylene particles and phase of polyvinylidene fluoride formed of primary polyvinylidene fluoride particles.

BONNET A, FINE T

Carbon-based material post-modification reactor, has feeding port located at a point upstream from reactor and adapted to feed carbon-based raw material into reactor, discharging port located at point downstream from reactor, screw conveying device disposed in reactor.

KU T, HSIEH C, LI J, GU D, XIE Z, LI Z

Thermally conductive sheet for semiconductor element, has polymer adhesive layer arranged on upper surface of substrate, where thermal conductivity of sheet is higher than about specific value.

LEE K, YU C

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Transferring one or more nanostructures from one substrate to another substrate by applying coating of crosslinkable copolymer over one or more nanostructures on surface of substrate, heating, transferring nanostructures and copolymer onto another substrate surface, and removing copolymer.

ARNOLD M S, JACOBBERGER R M, GOPALAN P, DWYER J H

Producing photoluminescence material involves placing plastic piece into working solution which is water, applying micro-plasma onto surface of the working solution, and degrading the plastic piece into multiple smaller molecular and graphene quantum dot.

CHIANG W, WENG R, WENG R J

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Powder coating composition used in manufacturing coating film which used in cookware such as frying pans, rice cookers, comprises first hot-melt fluoro resin particles which filler is dispersed in particles, second hot-melt fluoro resin particles and charge controlling agent particles.

NAKAZAWA R, TAKEYAMA M, PHAM H, KAMEYAMA S, PHAM H N